• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:

    公开号:NL1040222A
    申请号:NL1040222
    申请日:2013-05-21
    公开日:2013-12-04
    发明作者:Thomas Niemann；J Rgen Palloks
    申请人:Hella Kgaa Hueck & Co；
    IPC主号:
    专利说明:

    Title: Sensor with sensor element encased in a substrate
    The invention relates to a sensor with a support element and a sensor element encased in a substrate, the substrate comprising a cavity which forms an access to the sensor element.
    Such a corresponding type of sensor is known from DE 10 2008 016 214 A1. A sensor with a sensor element included therein is described in this publication. This is composed of several substrate layers. The sensor comprises an enclosure. A cavity is provided in the enclosure, which forms an access to the sensor element. In the area around the access to the sensor element, a trench-shaped recess is provided, which partially surrounds the sensor element.
    A further embodiment of a capacitive pressure sensor is known from DE 10 2004 018 408 A1.
    The invention is based on the object of providing a sensor of the above-mentioned type which is particularly resistant to stresses and other mechanical influences.
    The solution of this problem results in a sensor with the features of patent claim 1. Advantageous embodiments of the invention are described in the subclaims.
    In the case of a sensor with a support element and a sensor element that is enveloped by a substrate, wherein the substrate comprises a cavity which forms an access to the sensor element, it is essential for the invention that provision is made for the cavity in the substrate to be provided on the substrate. side facing the support element so that the access to the sensor element passes through the support element. In this way an optimum shielding of external influences for the sensor element results, since the connection leads through the carrier to the outside. This is a particularly robust version, whereby the outside and inside influences are minimized. The support element is thereby typically a metal support element, which on the one hand provides extra stability and on the other hand is also used for electrical connections. The side facing the support element is understood to mean the side where the support element is closer to the outside of the sensor than to the sensor element.
    In a preferred embodiment of the invention, the support element is lowered in the vicinity of the sensor element. This must be understood to mean that the support element forms at least two planes. The major part of the support element forms a first surface, which can also be referred to as the main surface. The supporting element is displaced with a small part relative to this main surface.
    This shift relates in particular to the environment of the sensor element in which the support element is shifted downwards so that the sensor element is arranged in this environment on or above the support element. The terms "down" and "over" or "up" refer to the relative position of the support element and the sensor element. The support element is herein preferably arranged for more than half its size approximately in the middle of the substrate. The support element is preferably formed as an electrical circuit board (Leadframe). The sensor element is also preferably included in the center of the substrate. Therefore, the lowered part of the support element is preferably eccentrically received in the substrate such that the sensor element is received in the center of the substrate. The sensor element is preferably arranged on the detection side of the support element. In particular, the sensor element rests with its detection side on the support element. In the (measuring) sensitive zone of the sensor element, the support element is naturally opened or broken through, so that there is access to the sensor element or to the sensitive zone or the detection area of the sensor element. The sensor is preferably a pressure sensor, in particular a capacitive pressure sensor.
    In another preferred embodiment of the invention, the sensor comprises at least one recess. A higher resistance to mechanical loading is obtained through these recesses. The recesses are preferably arranged on the top and bottom of the sensor. The sensor is typically designed as a flat rectangular component, from which electrical connections protrude from the sides. The terms top and bottom refer to the side with the largest flake size. The depth of the recess preferably extends beyond the main surface of the support element.
    In a preferred embodiment of the invention, on the side of the sensor, in which the cavity forms an access to the sensor element, a recess is provided which corresponds approximately in size to the cavity.
    This recess is preferably arranged adjacent to the cavity, more particularly in the transition region between the sensor element and the main surface of the support element and is passed through the main surface of the support element.
    In another development of the invention, a channel-like recess is provided on the opposite side of the cavity, which at least partially surrounds the environment of the sensor element. The recess herein comprises a bridge zone, over which electrical connections can be made. The channel-like recess preferably surrounds the sensor element on three sides. The recess from the other side is provided in the exposed bridge zone. The trench-like recess on the opposite side of the cavity is preferably also provided in the transition area between the main surface of the support element and the lowered area of the support element.
    In a preferred embodiment, this recess is generally flatter than the recess on the opposite side. The depth of these recesses is preferably formed beyond the main surface of the support element. However, a shorter version of this recess is also conceivable. In a particularly preferred embodiment, a recess can even be formed as a fully continuous breakthrough through the substrate.
    The invention is explained in more detail below with reference to an embodiment in the drawing. In detail, the schematic images show in:
    Figure 1: a schematic section through a sensor according to the invention;
    Figure 2: a perspective top view of a sensor according to the invention; and
    Figure 3: perspective view of the underside of a sensor according to the invention.
    Figure 1 shows a schematic section of a sensor 1 according to the invention. The sensor 1 according to the invention comprises a sensor element 2, which is arranged on a support element 3, which is formed as a connecting frame (Lead frame). The sensor element 1 and the support element 3 are enclosed by a substrate 4. Together, this provides an electronic sensor. The support element 3 can be subdivided into a main surface 15, a lowered zone 16, and a transition region 17 present between these two zones. The sensor element 2 is arranged on the lowered portion 16 of the support element 3. This is composed of three substrate layers 10, 11 and 12 and comprises a detection zone 20, which is directed downwards in the drawing. A cavity 5 is provided in the substrate 4, through which an access through the support element 3 leads to the sensor element 1, more precisely to the detection zone of the sensor element 1. In this environment an opening 6 is provided, so that the access can pass through the supporting element 3. The main surface 15 of the support element 3 extends substantially in the center of the sensor 1. The lowered zone 16 of the carrier element 3 is lowered so far that the sensor element 2, which rests on the lowered zone 16 of the carrier element 3, is itself arranged approximately in the middle of the sensor 1. Due to this embodiment, a high stability of the sensor is obtained against mechanical loads. For further improvement and uncoupling of the sensor element against mechanical influences on the sensor 1, recesses 7 and 8 are provided on both sides of the sensor element 1. The recess 8 is arranged in the sensor 1 on the opposite side of the cavity 5 and is formed as a trench, which is arranged circumferentially around the sensor element 2 in the transition region 17. This side is also referred to as top 23. The trench 8 then extends in its depth extent beyond the main surface 15 of the support element 3. The trench-like recess 8 is not completely arranged around the sensor element 2. This channel is not present in a bridge zone 13. In this bridge zone 13, in particular, the electrical sensor connections 18 are arranged between the sensor element 2 and the main surface 15 of the carrier element 3. These electrical sensor connections 18 extend close to the surface of the sensor 1 on the side where the recess 8 is located, i.e. on the opposite side of the cavity 5. The recess 7 on the underside 22, on which the cavity 5 is also arranged, extends extends in this bridge zone 13 near the sensor element 2. The depth of the recess then extends from the underside 22 to beyond the main surface of the supporting element 3. Above this, only the bridge part 13 remains, through which the electrical sensor connections 18 are passed .
    Figure 2 shows a perspective view of the sensor 1 with the top side 23 and the connecting elements 24 of the carrier element 3 protruding from the substrate 4. The gully-like recess 8, which is introduced into the substrate 4, can be clearly seen here. the environment of the sensor. The trench-like recess 8 does not completely enclose it, because the bridge part 13 remains, in which the electrical sensor connections 18 extend.
    Figure 3 shows a perspective view of the sensor element 1 with the underside 22. Here the cavity 5 can be seen, adjacent to the recess 7. The recess 7 corresponds to its dimensions approximately with the dimensions of the cavity 5, in particular it is arranged exactly opposite the bridge part 13.
    Overall, an optimum free placement of the sensor element is achieved to reduce the stresses and other mechanical influences. Because of the lowered position of the sensor element 2, the sensor 1 is shielded from the occurring voltages by the resulting framework from trench-like recess 8 and recess 7.
    权利要求:
    Claims (10)
    [1]
    A sensor with a support element (3) and a sensor element (2) encased in a substrate (4), the substrate (4) comprising a cavity (5) which forms an access to the sensor element (2), thereby characterized in that the cavity (5) in the substrate (4) is disposed on the side (22) facing the support element (3) so that the access to the sensor element (2) passes through the support element (3).
    [2]
    Sensor according to claim 1, characterized in that the support element (3) is lowered in the vicinity of the sensor element (2).
    [3]
    Sensor according to one of claims 1 or 2, characterized in that the support element (3) with more than half its size is received approximately in the center of the substrate (4).
    [4]
    Sensor according to one of the preceding claims, characterized in that the sensor element (2) is arranged approximately in the center of the substrate (4).
    [5]
    Sensor according to one of the preceding claims, characterized in that the sensor element (2) rests with its detection side on the support element (3).
    [6]
    Sensor according to one of the preceding claims, characterized in that the sensor (1) is a pressure sensor.
    [7]
    Sensor according to one of the preceding claims, characterized in that the sensor (1) comprises at least one recess (7, 8).
    [8]
    Sensor according to claim 7, characterized in that at least one of the recesses (7, 8) extends beyond the main surface (15) of the support element (3).
    [9]
    Sensor according to one of claims 7 to 8, characterized in that on the side (22) of the sensor (1), in which the cavity (5) forms an access to the sensor element (2), a recess (7) is provided which corresponds approximately in size to the cavity (5).
    [10]
    Sensor according to one of claims 7 to 9, characterized in that the sensor (1) on the opposite side (23) of the cavity (5) has a channel-like recess (8) that surrounds the sensor element (2) at least partially surrounded.
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    同族专利:
    公开号 | 公开日
    BG66744B1|2018-10-15|
    DE102012010842A1|2013-12-05|
    NL1040222C2|2015-07-16|
    BG111470A|2015-02-27|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US5948991A|1996-12-09|1999-09-07|Denso Corporation|Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip|
    US6300169B1|1999-06-25|2001-10-09|Robert Bosch Gmbh|Method for manufacturing a pressure sensor|
    US20080236292A1|2007-03-30|2008-10-02|Elmos Advanced Packaging B.V.|Sensor element and sensor assembly provided with a casing|
    WO2008138666A1|2007-05-15|2008-11-20|Robert Bosch Gmbh|Differential pressure sensor arrangement and corresponding production method|
    US20120049298A1|2010-08-31|2012-03-01|Freescale Semiconductor, Inc.|Mems device assembly and method of packaging same|
    DE102010043982A1|2010-11-16|2011-12-15|Robert Bosch Gmbh|Sensor arrangement, has mold-housing comprising access port provided with sensitive region and sense element, and stress decoupling structure formed in sense element, where sense element is formed between mold-housing and sensitive region|
    JPH05206354A|1992-01-24|1993-08-13|Mitsubishi Electric Corp|Semiconductor pressure sensor and its manufacture|
    DE102004018408A1|2004-04-16|2005-11-03|Robert Bosch Gmbh|Capacitive pressure sensor and method of manufacture|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    DE102012010842|2012-05-31|
    DE201210010842|DE102012010842A1|2012-05-31|2012-05-31|Sensor, particularly capacitive pressure sensor, has recess that is arranged on side that faces support element, so that access to sensor element guides through support element, where support element is lowered in region of sensor element|
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